![X-ray inspection equipment [TRI Corporation] detects defects in TGV and Cu pillars with high precision.](https://image.mono.ipros.com/public/product/image/2001630667/IPROS18262257637032920383.png?w=280&h=280)
X-ray inspection equipment [TRI Corporation] detects defects in TGV and Cu pillars with high precision.
High adoption record in the electronic implementation and semiconductor AXI market.
Defect detection in semiconductor manufacturing processes, including TGV and Cu pillars, is essential for improving yield, yet existing optical inspections have limitations. TRI's X-ray equipment has a rich track record in the semiconductor AXI market and meets the high-performance and fine inspection needs with a maximum resolution of 2µm and up to 1000 CT slices. ■ Main Inspection Targets - AI Cu pillar inspection - TGV 3D AXI inspection - C4 bump inspection - SiP 3D AXI support ■ Main Benefits - Maximum resolution: 2µm - X-ray output: up to 110kV - Supports large substrate inspections - Dose limits and estimates can be managed via software - Initial adjustments and fine-tuning by AI We also welcome inquiries about models other than the TR7600F3D SII Plus introduced here. Please feel free to contact us.
- Company：Shinwa Co., Ltd. Mechatronics System Center
- Price：Other
